Hot Melt Flooring Adhesive
TH-8203B is a high-performance hot-melt flooring adhesive based on APAO, engineered for silent-floor applications. Melted at 160–190 °C, it quickly laminates the factory-applied sound-insulation pad to the back of vinyl, SPC or WPC planks, creating an immediate, permanent bond. The 100 % solid formula is solvent-free, delivers excellent peel strength and retains flexibility across –20 °C to +80 °C, so the silent layer stays firmly in place even under heavy traffic or temperature swings.
Description
Key features
1. APAO Polymer Backbone
The adhesive is synthesized from amorphous poly-alpha-olefin (APAO), giving it an ideal balance of aggressive tack, long open time and permanent elasticity that is especially suited for silent-floor laminates.
2. Natural-White, Non-Yellowing Blocks
Each 1 kg pillow-shaped block is naturally white, free of titanium dioxide or optical brighteners, so it will not discolor light-colored vinyl, WPC or SPC back layers even after long-term UV exposure.
3. Fully Compostable, Low-Melt Film Wrap
Individual blocks are encased in a 40 µm fusible film that melts and becomes part of the hot melt flooring adhesive at 170 °C, eliminating packaging waste and reducing downtime for cleaning melters.
4. Precise Melt-Point & Softening Window
With a Ring-&-Ball softening point of 130–140 °C, the product remains rigid in summer warehouses yet flows readily at 160–180 °C, preventing stringing and edge-bleed on high-speed laminating lines.
5. Optimized 170 °C Viscosity
At 170 °C the Brookfield viscosity is 2 100 cP, thin enough for spiral spray, slot-die or smooth-roll coating, yet high enough to prevent strike-through on open-cell EVA or IXPE acoustic pads.
6. Multi-Mode Application Flexibility
TH-8203B can be applied by:
– engraved-roll transfer (2–8 g/ft²),
– random swirl spray (5–15 g/ft²),
– or slot-die curtain (10–25 g/ft²), giving flooring producers freedom to switch between discrete plank lamination and continuous sheet lines without changing adhesive SKU.
7. Instant Green Strength & Fast Set
The formulation crystallizes within 8–12 s after nip exit at 25 °C ambient, allowing immediate stacking, packaging and skidizing-no clamping fixtures or curing ovens required.
8. Wide Service-Temperature Range
Bonds retain >80 % of initial peel strength from –30 °C (cold-crack resistance) to +90 °C (summer attic conditions), meeting EN 14293 and ASTM D7799 climate-cycle specifications.
9. Superior Acoustic-Dampening Retention
Because the APAO matrix stays flexible, the laminated IXPE or cork pad maintains its impact-sound reduction (ΔLw ≥ 19 dB) after 10 000 rolling-load cycles, outperforming stiff EVA or reactive PUR systems.
10. Green & Safe Chemistry
The hot melt flooring adhesive is 100 % solids, zero formaldehyde, zero isocyanate and zero phthalate, complying with FloorScore, REACH, TSCA and LEED v4 low-emitting materials criteria. VOC emissions <10 µg/m³ after 24 h (ISO 16000-6).
11. Excellent Adhesion Portfolio
Demonstrated bond values on typical substrates:
– SPC to IXPE: 3.8 N/mm peel (EN 431)
– WPC to cork: 4.1 N/mm peel
– LVT to non-woven glass: 3.5 N/mm peel
Failure mode consistently cohesive within the pad, never interfacial.
12. Thermal & Hydrolytic Durability
72-h soak at 50 °C water followed by 24-h freeze at –20 °C shows <5 % peel loss; 500-h Q-UVB exposure at 60 °C shows no delamination or embrittlement, outperforming standard EVA hot-melts by >3×.
13. Clean Machinability
Low smoke (<5 mg/m³ @ 170 °C), minimal char and no gel formation after 48 h continuous pot life, reducing nozzle purge frequency and extending gear-pump service intervals.
14. Easy Storage & Handling
1 kg individually wrapped blocks, 20 kg per carton. Shelf life 24 months below 35 °C and <50 % R.H., no refrigeration needed.
Product Specification Information
|
MODEL NUMBER |
TH-8203B |
BRAND |
Tianze |
|
FORM |
Block |
SIZE |
|
|
COLOR |
White |
MAIN INGREDIENTS |
APAO |
|
SOFTENING POINT |
130-140℃ |
VISCOSITY @170℃ |
Low |
|
OPEN TIME |
SETTING TIME |
||
|
PACKING |
20kg/box |
SAMPLE |
Free sample available |
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