Hot Melt Adhesive for Electronics
Model TH-703, Hot Melt Adhesive for Electronics is a pure-white adhesive that secures PCBs, wire tacks and housings in seconds while forming a dust- and splash-proof seal. Its 110 °C softening point stays rigid inside appliances operating up to 75 °C, so bonds will not creep under transformer heat or motor vibration. Made from hydrogenated resins and food-grade EVA, the ultra-low-VOC formula helps factories pass REACH, RoHS and indoor-air audits without extra ventilation.
Description
Key features
Hot Melt Adhesive for Electronics was developed specifically for white-goods, power-tool, LED-driver and small-appliance manufacturers that need rapid, clean assembly combined with long-term environmental protection. The adhesive extrudes smoothly at 150-170 °C through 11 mm glue guns or micro-dispensing heads, wetting ABS, PC, PP, aluminum and copper without corrosion or bloom. Within 3-6 seconds the bond cools to a tough, white, non-yellowing thermoplastic that delivers 3.5 MPa shear strength on ABS/ABS joints and passes 1000 h at 70 °C/85 % RH without weight loss or cracking.
A precisely tuned 110 °C Ring-&-Ball softening point keeps the polymer solid during normal appliance self-heating, yet allows low-temperature application that protects heat-sensitive components such as SMD capacitors and thin-wall plastics. Once set, the adhesive forms a continuous water-blocking film that achieves dust-sealing on enclosure seams, cord entries and potting-free PCB edges, cutting the need for silicone gaskets or two-part epoxies. Hydrogenated tackifying resins remove unsaturated double bonds, yielding VOC emissions below 50 µg g⁻¹ (EU ISO 16000-6) and odor levels undetectable at 50 mm distance, helping production lines meet LEED, WELL and BSCI indoor-air standards.
The formulation is 100 % free of halogens, antimony, heavy metals, phthalates and formaldehyde, complying with RoHS 2.0, REACH SVHC 240. Resistivity tests show 3.8 × 10¹⁵ Ω cm volume resistivity and 520 V/mil dielectric strength, making the cured adhesive safe around 230 V circuits and LED solder points. This hot-melt stick tacks parts fast, seals against moisture and dust, survives appliance operating temperatures and keeps the work floor green, Hot Melt Adhesive for Electronics offers a ready-to-use, cost-saving solution that passes every compliance audit.
Product Specification Information
|
MODEL NUMBER |
TH-703 |
BRAND |
Tianze |
|
FORM |
Stick |
SIZE |
11.2*300mm |
|
COLOR |
White |
MAIN INGREDIENTS |
EVA |
|
SOFTENING POINT |
105-115℃ |
VISCOSITY @170℃ |
High |
|
OPEN TIME |
Medium |
SETTING TIME |
Fast |
|
PACKING |
20kg/box |
SAMPLE |
Free sample available |
Q&A
Hot Tags: hot melt adhesive for electronics, China hot melt adhesive for electronics manufacturers, suppliers, factory, Best Glue Gun for Electronics, Electronics Hot Melt, Hot Glue For Electronics, Hot Melt Adhesive For Electronics, Hot Melt For Electronics
Send Inquiry
You Might Also Like
