The Concept Of High Melting Point Polyamide Hot Melt Adhesive

High-melting-point polyamide hot-melt adhesive is a hot-melt adhesive with polyamide resin as its main component. It has a melting temperature of 140–150℃ and is primarily used in shoemaking processes such as leather folding, cold pressing, and molding. Its preparation involves using dimer linoleic acid, sebacic acid, ethylenediamine, and hexamethylenediamine as raw materials, and producing polyamide resin through a high-temperature polycondensation reaction under nitrogen protection. The process includes staged heating, depressurization, and amine value testing.

The softening point of this adhesive can be altered by adjusting the raw material ratio, making it suitable for processing in a temperature range of 140–200℃. To improve high-temperature stability, 1% of a pyrazole-based anti-aging agent (such as 1-phenyl-3-pyrazole) is typically added to the adhesive solution, ensuring stable performance even at 260℃.