Polyamide Hot Melt Garnules

Polyamide hot-melt granules are an amber-colored, high-performance thermoplastic adhesive engineered for demanding assembly environments where speed, strength and versatility are equally critical. The resin is supplied as uniform, low-dust cylindrical granules that melt rapidly at 140-160 °C to a low-viscosity fluid (≈ 3 000–5 000 mPa·s @ 160 °C). This exceptionally low melt viscosity ensures outstanding wetting of porous, rough or dissimilar substrates-paper, non-woven media, leather, ABS, PC, PA, steel and aluminum-without the need for primers or mechanical fasteners.

The adhesive is purposely balanced for fast set-up: it reaches handling strength in 5–10 seconds after compression, allowing downstream operations such as trimming, stacking or packaging to begin almost immediately. Yet it still offers a medium open time of 4–12 seconds (substrate and ambient dependent), giving operators or robotic dispensers sufficient window to align parts, correct positioning or perform secondary assembly steps before the bond locks irreversibly. This combination shortens cycle times on high-speed rotary or indexing lines while minimizing rejects caused by premature skin-over.

Once cooled, the polyamide backbone delivers a tough, flexible film with:

- Tensile strength ≥ 6 MPa

- Shore A hardness 92–96

The bond remains resilient from –20 °C to +110 °C, with brief spikes to 130 °C without creep or embrittlement. It exhibits excellent resistance to:

- Oils

- Plasticizers

- Dilute acids/alkalis

- UV exposure

This makes the granules ideal for:

1. Filter industry – Pleat stabilization, end-cap and seam bonding in HEPA, automotive fuel and air filters; the adhesive withstands pulsed pressure differentials and hot-oil aging tests > 1 000 h @ 95 °C.

2. Footwear manufacturing –PA hot-melt granules are melted into 160–180 °C spray or slot-coat lines to lay a thin, high-strength bonding layer that secures toe puffs, counters and insole boards in under 5 s.
The tough, flexible polyamide seam survives 100 000 flexes and 40 °C wash cycles, yet stays breathable and solvent-free.
Because it re-melts only above 120-130 °C, the same adhesive withstands post-molding ovens and vulcanization, making it the reliable choice for safety, outdoor and premium athletic footwear.

3. Low-pressure molding of electrical/electronic components – Encapsulation of PCB assemblies, cable joints, sensors and coil windings; the low injection pressure (<10 bar) eliminates mechanical stress, while the amber color allows visual inspection and laser marking.

The product is RoHS and REACH compliant, contains no solvents or isocyanates, and is 100 % solid-eliminating VOC emissions and simplifying workplace safety. Granules can be processed in:

- Standard piston or gear-type melters

- Autoload hopper systems

- Recirculating tank units

Stable viscosity profiles and excellent thermal stability (≤ 2 % viscosity drift after 48 h @ 180 °C) reduce char formation and equipment downtime. In short, these amber polyamide hot-melt granules provide production engineers with a single, robust adhesive platform that unites rapid curing, forgiving open time and durable performance across filters, shoes and precision electronics.

Hot Tags: polyamide hot melt garnules, China polyamide hot melt garnules manufacturers, suppliers, factory, Book Side Binding Glue Granules, EVA Hot Melt Granules, Fast Setting Hot Melt Glue Granules, Hot Melt Adhesive Pellets, Hot Melt Glue Granules for Case Packing, Sprayable Hot Melt Glue Granules