Polyamide Adhesives
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Polyamide Adhesives

Polyamide Adhesives

TH-9150 and TH-9180 are high-performance polyamide hot-melt adhesives engineered for the automotive and electronics industries. TH-9150 softens at 150 °C, while TH-9180 withstands 180 °C, both delivering exceptional bond strength on interior and exterior vehicle parts such as dashboards, door panels and seats, as well as under-hood components exposed to heat, oil and vibration. Their robust formulation also secures, encapsulates and protects electronic assemblies, providing reliable insulation and mechanical reinforcement on PCBs and sensors. Low application viscosity combined with rapid green strength speeds automated assembly without sacrificing long-term durability.

Description

Key features

 

Polyamide adhesive is the core technology behind TH-9150 and TH-9180, two high-performance hot-melt formulations engineered for the most demanding automotive and electronics assembly challenges. TH-9150 softens at 150 °C, while TH-9180 extends thermal capability to 180 °C; both grades are supplied as uniform black pellets that melt quickly to a low-viscosity fluid, yet develop immediate green strength for fast handling and short cycle times. The resins are 100 % solids, RoHS/REACH compliant and emit virtually no VOCs, giving manufacturers a clean, worker-friendly alternative to solvent or reactive chemistries.

 

Inside the vehicle, the polyamide adhesive family creates structural, vibration-damped bonds between dissimilar substrates used in dashboards, door cards, headliners and seat shells. It wets and anchors to PP, ABS, PC, PA, SMC, aluminum without extensive pretreatment, maintaining elasticity from –40 °C to far above cabin temperatures. TH-9180 in particular is specified for engine-compartment applications-air-cleaner housings, powertrain covers, sensor brackets-where prolonged exposure to 150 °C air, ATF, motor oil and road salt would destroy conventional olefinic or EVA hot melts. Its hydrophobic backbone resists moisture uptake, so bond strength and dimensional stability remain unchanged after 1000 h SAE J2196 immersion tests.

 

Beyond the car body, the same polyamide adhesive chemistry functions as a low-pressure molding compound for electronic encapsulation. When heated to 180–220 °C and injected at 3–15 bar, TH-9150 and TH-9180 flow gently around fragile PCBs, solder joints, connectors and fine-pitch sensors, solidifying within seconds to form an IP68-rated shell. The resultant encapsulant delivers 20 kV mm⁻¹ dielectric strength, –40 °C to 150 °C thermal cycling tolerance, and 30 % elongation that absorbs mechanical shock without cracking. Harness makers therefore adopt it as a one-shot replacement for multi-step epoxy potting or over-molding, cutting labor cost while speeding throughput.

 

Both grades are supplied in moisture-proof, 25 kg bags that can be fed directly to standard hot-melt tanks or low-pressure molding machines. Storage at room temperature preserves performance for at least two years, eliminating cold-chain expense. Whether the task is bonding exterior trim clips in the paint shop or sealing battery-management electronics deep in the power-pack, TH-9150 and TH-9180 polyamide adhesive systems provide automotive and electronics OEMs with a greener, leaner path to long-term reliability.

 

Product Specification Information

 

MODEL NUMBER

TH-9150 / TH-9180

BRAND

Tianze

FORM

Granule

SIZE

 

COLOR

Black

MAIN INGREDIENTS

Polyamide

SOFTENING POINT

150℃ / 180℃

VISCOSITY @170

Medium

OPEN TIME

4-8 S

SETTING TIME

2-3 S

PACKING

25kg/bag

SAMPLE

Free sample available

 

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