Introduction To Polyamide Hot Melt Adhesives

Polyamide hot melt adhesive, also known as dimer acid polyamide hot melt adhesive, is a polymer material made from diacids and diamines through a copolymerization reaction, and then processed through modification and pulverization. Its preparation is based on the high-temperature condensation of dimer acids and polyamines, and it is divided into two categories: high molecular weight (good flowability, dry cleaning resistance) and low molecular weight (strength and toughness superior to EVA). It is widely used in bonding fabrics, leather, metals, and ceramics, as well as in the protection of electronic components and bookbinding.

This material has a softening point range of 100°C to above 200°C, a temperature tolerance of -40°C to 200°C, and a specific gravity of approximately 0.97 at room temperature. Its basic color is amber, which can be adjusted to black, white, or other colors by adding carbon black, titanium dioxide, etc. The raw material polyamine must be stored in waterproof packaging. It must be used in conjunction with a hot melt adhesive machine, and the equipment should be cleaned regularly to prevent high-temperature carbonization and clogging.