New Product Development Of Hot Melt Adhesives

Curing hot melt adhesives and functional hot melt adhesives are two major categories of new products on the market. The former's main characteristic is improved high-temperature resistance, raising the softening point to above 120℃, thus expanding its application range. Functional hot melt adhesives, on the other hand, are designed for specific applications, achieving specific functions to meet various needs. Examples include water-soluble or dispersible hot melt adhesives, hot melt sealants, and hot melt pressure-sensitive adhesives.

In addition to the more commonly used EVA and TPR hot melt adhesives, companies should focus on researching and developing advanced hot melt adhesive products that are already widely used in the West and have significant application potential. These include reactive hot melt adhesives, water-dispersible hot melt adhesives, high-grade PA hot melt backing granules, and high-strength hot melt pressure-sensitive adhesives. Simultaneously, domestic raw material manufacturers should recognize the development potential of the hot melt adhesive industry, accelerate the increase in the localization rate of raw materials, and reduce foreign exchange losses caused by large-scale imports of raw materials.